Type: Pad Per Hole
Size: 3×6 in – (76×152 mm)
Board Thickness: 0.062 in – (1.6 mm)
Copper Thickness: 35 Microns 1oz
Copper Surface Finish: Hot Air (RoHS) Solder Leveling
Copper Square Size: 0.08×0.08 in – (2×2 mm)
Copper Square Quantity: 1800 Pads
Hole Size: 0.039″ 1mm (CNC Drilled)
Hole Pitch: 0.1 in – (2.54 mm)
Entire Hole Quantity: 1800 Holes
Weight: 30g (1.05oz)
UPC Code: 666561002411
prototyping board – Printed Circuit Board
Epoxy Fiber Material Advantages:
- Is a heavy duty material resists on high wattage soldering iron.
- Good for re soldering and replacing Components & wires several times, in prototype process.
- Boards is so strong against heat and mechanical influences.