3″x4″ CEM-1 Pad Per Hole Tin(RoHS HASL)

USD $4.30 USD $2.15

In stock


Type: Pad Per Hole
Material: CEM-1
Size: 3×4 in – (76×101 mm)
Board Thickness: 0.062 in – (1.6 mm)
Copper Thickness: 35 Microns 1oz
Copper Surface Finish: Hot Air (RoHS) Solder Leveling
Copper Square Size: 0.08×0.08 in – (2×2 mm)
Copper Square Quantity: 1200 Pads
Hole Size: 0.039″ 1mm (CNC Drilled)
Hole Pitch: 0.1 in – (2.54 mm)
Entire Hole Quantity: 1200 Holes
Weight:20g (0.7 oz)

UPC Code: 666561002268

prototyping board – Printed Circuit Board



Epoxy Fiber Material Advantages:

  • Is a heavy duty material resists on high wattage soldering iron.
  • Good for re soldering and replacing Components & wires several times, in prototype process.
  • Boards is so strong against heat and mechanical influences.



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