3/4×3.3in Pad Per Hole (TPH)

USD $0.95 USD $0.50

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Type: Pad Per Hole (THP)
Base Material: Epoxy Fiber
Size: 3/4 ×3 1/8 in – (20×80 mm)
Board Thickness: 0.062 in – (1.6 mm)
Copper Thickness: 35 Microns 1oz
Copper Surface Finish: Hot Air (RoHS) Solder Leveling
Copper Square Size: 0.08×0.08 in – (2×2 mm)
Copper Square Quantity: 168 Pads (26×6)
Hole Size: 0.039″ 1mm (CNC Drilled)
Hole Pitch: 0.1 in – (2.54 mm)
Entire Hole Quantity: 168 Holes (4 Hole 1/8in 3mm in 4 Conner for installation)

UPC Code:

prototyping board – Printed Circuit Board

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